Atomic Force Microscopy (Switzerland)Optical Profilometry (US)Various X-ray Analysis techniques (XRF/TXRF,2D,3D) (Japan) Electroluminescence (EL) Testing (Germany)Nano Indentation and Tribological Analysis (US)LIBS/LA-ICPMS (US)Film Thickness Analysis (spectral reflectometer) (US)Broad Range of CVD Processing (France)Broad Range of Wet Bench processing and Bulk Chemical Distribution (US)Spin Rinser Dryers (SRDs) and Megasonic Cleaning (US)
PLEASE EMAIL FOR ADDITIONAL INFORMATION